SAC-TEC GROUP
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| SAC-TEC
LABS, INC. |
SAC-TEC
MICRO DEVICES INC |
MONOLITHICS, HYBRIDS, MULTI CHIP MODULES AND
MICROWAVE
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ASSEMBLY
Build to Print
Chip and wire
Epoxy, solder or eutectic die attach
Aluminum and Gold wire bond capability
Gold Ribbon bond capability
Hermetic and Non-Hermetic package sealing
Mil Std. 883 capability
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TESTING
Environmental
Electrical
Qualification |
SPACE AND MILITARY
CERTIFICATION
Upscreening
Class ’S’ processing
Radiation evaluation and certification
Radiation Enhancement |
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ENGINEERING SUPPORT
Emulation
Design
Component Engineering
Packaging
Test Software
Burn-in Fixturing
CAD Layout |
AFTER MARKET
Obsolete Inventory
Parts Procurement
Parts Recertification |
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