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Services:microelectronic
packaging, integrated circuit packaging, IC
packaging,Hi-Rel, die attach, wire bonding, mil std 883, hermetic, class S, class B, multi chip modules, MCM, MCM-C,MCM-H, MCM-L, MCM-D, surface mount modules, hybrids, mil-spec testing, memory modules, military, burn-in, testing, ISO 9000,chip, microchip, custom package design, environmental screening, obsolete microcircuits
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